As the world's largest specialized integrated circuit manufacturing services company.TSMCTSMC is a major player in the semiconductor industry. Every year, many job seekers aspire to join TSMC and start a new chapter in their career. At programhelp, we have witnessed many students successfully pass the TSMC interview and have accumulated a wealth of counseling experience. Today, we will analyze TSMC's interview process, question types, and real questions to help you get the offer of your choice.
TSMC Interview Process
Qualification Filter
TSMC's resume selection process is relatively rigorous, focusing on the applicant's professional background, relevant project experience, and internship experience. For technical positions, emphasis will be placed on professional course grades, technical applications and achievements in research projects, such as participation in wafer architecture design and semiconductor material development, as well as specific tasks and roles in the projects.
written examination
There may be a written test session for some technical positions. The content will cover specialized knowledge such as semiconductor physics, principles of circuits, electronic engineering and other basic knowledge. For example, it will test the semiconductor carrier law of motion, Kirchhoff's law in circuit analysis, etc.; there may also be logical reasoning questions to test the candidate's ability to think and analyze the problem, such as numerical reasoning, graphical reasoning, and other questions.
Interview Sessions
One side (the technical side):
Interviewers are mostly technical backbones of the department, and will dig deeper around the project experience in the resume. The interviewers will ask about the technical difficulties in the project, solutions, and personal contributions in the project. Professional knowledge will also be examined, such as the wafer manufacturing process, lithography technology principles, circuit design methods, and so on. For example, they will ask how to ensure the precision of graphics in the photolithography process and how to optimize the power consumption in CMOS circuit design.
Second Side (Integrated Technical Side):
Interviews are usually conducted by senior technical experts or department heads. This round of interviews pays more attention to the depth and breadth of the applicant's skills, as well as the ability to solve complex problems. Some actual technical problems will be given to the applicant to analyze the solution on the spot; they will also be asked about the understanding and views of the industry's cutting-edge technology, such as the advanced packaging technology, the application of new semiconductor materials.
HR Interview:
The main purpose of the interview is to confirm salary expectations, starting date, work location, etc. At the same time, HR will introduce the company's benefits and corporate culture to the applicant. At the same time, HR will introduce the company's benefits and corporate culture to job seekers, which is also a good opportunity for job seekers to know more about the company.
TSMC Interview Interview Questions
Professional Knowledge
In-depth examination of semiconductor manufacturing processes, such as lithography, etching, doping, etc., in terms of principles, operating points and quality control methods. For example, it will ask how to control the etching rate and selectivity during the etching process.
The design aspects of electronic circuits, including the principles of analog and digital circuit design, analysis methods, and common tools. The topics covered include designing a simple amplifier circuit, or explaining the concept of timing logic in digital circuits.
Materials science to understand the properties of semiconductor materials, how they are prepared, and how they are used in wafer fabrication. For example, the effect of the crystalline structure of silicon materials on their electrical properties.
Project Experience
Inquire about the background, objectives, tasks undertaken, problems encountered and solutions for projects in which the job seeker has been involved in the past. For example, in a wafer design project, how to coordinate team members to complete the design and integration of different modules, and what remedial measures were taken when the project was delayed.
Technology Innovation
Candidates are tested on their sensitivity to new technologies and innovative thinking. They are asked how they see the impact of emerging technologies in the industry on TSMC's business, and what improvements and innovations they would make to existing technologies if given the opportunity. For example, they will be asked what they think about the possibility of applying quantum computing technology in future chip design.
Teamwork
Ask questions about the candidate's ability to collaborate on team projects. For example, how do you reconcile different points of view to reach a consensus when the team disagrees, or share an experience of helping others to solve a technical problem in a team.
TSMC Interview Real Questions
True Question 1: Optimization of Lithography Process Parameters
Description:
In the photolithography process, in order to guarantee the graphic accuracy, it is necessary to control the light intensity difference between neighboring pixels not to exceed a threshold value. Given a two-dimensional grid representing the light intensity distribution, the value of each cell represents the light intensity at that point, and the light intensity distribution after the smoothing process is calculated. The smoothing rule is: the new light intensity value of each cell is the average of its own light intensity and that of the neighboring cells in 8 directions around it (if it exists).
light_intensity = [
[10, 20, 30],
[40, 50, 60], [70, 80, 90].
[70, 80, 90]
]
threshold = 15 Output:
[
[30, 35, 40],
[45, 50, 55],
[60, 65, 70]
] True Question 2: Chip Test Case Generation
Description:
Design a function that generates all possible combinations of test vectors for verifying the I/O interface of the chip. Given a range of possible values for each input pin (represented as a list), return all possible combinations of inputs.
pin_ranges = [
[0, 1], possible values for # pin 1
[0, 1, 2], Possible values for # pin 2
[1] Possible values for # pin 3
] Output:
[
[0, 0, 1],
[0, 1, 1],
[0, 2, 1],
[1, 0, 1],
[1, 1, 1],
[1, 2, 1]
] True Question 3: Wafer Defect Detection Algorithm
Description:
In wafer surface inspection, defects usually appear as a succession of abnormal pixel points. Given a two-dimensional array representing the wafer surface image (0 for normal, 1 for possible defect points), the area of all defective regions is calculated and the top K defective regions with the largest area are returned.
wafer_image = [
[0, 0, 0, 0],
[0, 1, 1, 0],
[0, 0, 0, 1]
]
K = 2 Output:
[4, 1] PROGRAMHELPTeams to help you succeed in your interviews
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