台灣積體電路製造股份有限公司 (Taiwan Semiconductor Manufacturing Company, 簡稱：台灣積體電路) 為全球半導體晶圓代工的領導廠商。TSMC)針對軟體和硬體工程職位維持一套結構化的面試程序。台積公司對於軟體與硬體工程人員的面試流程，都有一套完整的結構化問題與評量標準，以符合半導體產業的獨特需求。本文將深入剖析台積公司的面試流程，分享範例問題，並提供實用的面試準備技巧，助您在面試中脫穎而出。
TSMC Interview Round 1: Coding
The first round of TSMC’s software engineering interviews typically focuses on algorithmic coding and programming. Questions aredesigned around real-world semiconductor scenarios, emphasizing candidates’ programming proficiency, logical thinking, andunderstanding of hardware-related contexts. Unlike LeetCode problems, these questions prioritize code correctness, modular design, and practicalapplication in semiconductor manufacturing processes such as wafer test data processing or production scheduling optimization.
Sample Coding Questions
Description: Given an array representing a stream of semiconductor wafer test results (where 1 indicates pass and 0 indicates fail), write a function to calculate the maximum number of passing results within any sliding window of size k.
Input: tests = [1, 0, 1, 1, 0, 1, 1, 1, 0], k = 3
Output: 3
Explanation: The window [1, 1, 1] contains three consecutive passing results, which is the maximum count.
TSMC Interview Round 2: System Debugging
The debugging round is a distinctive feature of TSMC interviews, evaluating candidates’ ability to troubleshoot complex systems.Candidates are typically provided with a simulated wafer test script or production scheduling code (written in languages like Verilog, Python, or C++)and must identify and fix issues. This may involve correcting logical errors or optimizing performance discrepancies.
Sample Debugging Task
Problem: Given a Python script for calculating wafer test yield rates, identify and fix errors causing incorrect results for certain inputs.
Code Snippet (with bug):
def calculate_yield(tests):
total = 0
passed = 0
for test in tests:
total += 1
if test == 1:
passed += 1
return passed / total # Bug: no handling for total = 0TSMC Interview Round 3: System Design
The system design round assesses candidates’ ability to architect solutions tailored to semiconductor manufacturing. Topics mayinclude wafer production scheduling systems, wafer testing pipeline designs, or data analytics platforms. Unlike tech companies, TSMC’s system design questions emphasize hardware constraints (e.g., power consumption, latency) and operational efficiency.
Sample Question
Task: Design a wafer testing scheduling system capable of managing multiple testing machines and wafer batches with varying priorities. Consider factorssuch as machine utilization, test time optimization, and error handling.
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